http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-1966197-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3af3390937c06df72b00e23a42cf63ef |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate | 1969-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1feb0615e9d894331f4b65a39eeb802d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_565188041476d4d721e59f13072f86bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63d2cf2de076f91ffeb8ed3ca1c9fbd1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_619eec3b4b54048f23783d64f0919c4f |
| publicationDate | 1972-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-1966197-A1 |
| titleOfInvention | Aqueous bath for the chemical deposition of ductile copper coatings |
| abstract | An aqs electroless Cu plating solution comprising a Cu++ salt (e.g. sulphate) a source of OH- (e.g. NaOH), HCHO or a precursor of it (e.g. paraformaldehyde) and sufficient complexing agent to render the Cu++ soluble in alkaline solution, has added >=1 ppm each of an organic silicon compound, e.g. silane or polysiloxane, and a hydrogen inclusion retarding agent, e.g. a simple or complex cpd of one or more of CN-, V, W, Mo, Nb, Re, As, Sb, Bi and rare earth metals, the total amount of the additives being insufficient to prevent Cu deposition. A formaldehyde addition agent, e.g. sulphite, bisulphite or phosphite, may be included in the solution and/or the salt of a Group VIII metal e.g. phosphate, nitrate, halide or acetate. |
| priorityDate | 1969-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 131.