| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
1996-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_223602daff8b1ddf297381246058a61a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34c71aac9d8dc0da672e3040d63ec1cd |
| publicationDate |
1998-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-19653681-A1 |
| titleOfInvention |
Process for the electrolytic deposition of copper layers with uniform layer thickness and good optical and metal-physical properties |
| abstract |
A process for the electrolytic deposition of copper layers, in particular on printed circuit boards, has the following steps: an electroconductive substrate and anodes which are dissolved during electrolytic deposition are brought into contact with a deposition bath which contains copper ions, compounds which increase the electroconductivity of the deposition bath, additives for influencing the material properties of the copper layers, additional compounds of an electrochemically reversible redox system, and additives or mixtures of additives. The substrate and the anodes are connected to a current supply and the copper layers are deposited on the substrate by a pulsed current or pulsed voltage process. This process allows metallic layers with good optical and mechanical properties to be deposited even after only a short stay in the bath. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007112971-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007112971-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8784634-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19915146-C1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101416569-B |
| priorityDate |
1996-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |