http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19622704-A1

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filingDate 1996-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2334e8cddcf8a98980493751d1993e78
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publicationDate 1996-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-19622704-A1
titleOfInvention Epitaxial wafer and method for its manufacture
abstract The epitaxial wafer has n-conductive and p-conductive epitaxial layers (1-4; 6,7) forming a pn junction, the epitaxial layers formed from GaAsP with a P of at least 45%, or from GaP. The p-conductive epitaxial layers are provided by a first layer (6) at one side of the pn junction with a carrier conc. of between 0.5 and 5 times 10 to the power 18 per cubic cm and a second surface layer with a carrier conc. of at least 5 times 10 to the power 18 per cubic cm.
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priorityDate 1995-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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