| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S205-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 |
| filingDate |
1995-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_223602daff8b1ddf297381246058a61a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75e98a76b13238d542d0ab5a0ce621ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_796ff03d097bc8f7fb3fc0e04f8c507c |
| publicationDate |
1997-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-19545231-A1 |
| titleOfInvention |
Process for the electrolytic deposition of metal layers |
| abstract |
The invention relates to a process for the electrolytic deposition of metal layers, in particular copper layers, of specific physico-mechanical and optical characteristics and of even thickness. With known processes using dissolving anodes and direct current, only an uneven metal layer distribution can be achieved on articles of complex shape. The problem of uneven layer thickness at different points on article surfaces can be alleviated by using a pulsed current or pulsed voltage process, but this does not solve the other problem of continually changing geometry during deposition as the anodes dissolve. This problem can be eliminated by using non-dissolving anodes. To ensure adequate anode stability and a high lustre of the layers even at points on the workpiece surface where the metal is deposited with high current density, compounds of an electrochemically reversible redox system must be added to the deposition solution. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101416569-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0044042-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112005000842-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007112971-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007112971-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010094998-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19925373-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19925373-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19915146-C1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/NL-1015348-C2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6793795-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8784634-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10259362-A1 |
| priorityDate |
1995-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |