| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 |
| filingDate |
1995-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c972d3780118f9b41a8449dcc9ca3a8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ad0cd7ce5c40fe7554ef392baa27491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0acb4e6ba433f7b67bf1e7f69be9e7da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_380953c5202765903a39da836e5d2c7b |
| publicationDate |
1995-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-19521330-A1 |
| titleOfInvention |
Resin composition containing filler suitable for injection molding and transfer molding |
| abstract |
A molding resin composition contains a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 mu m and not greater than 1.5 mu m (x component), a globular powder of which mean particle diameter is not smaller than 2 mm and not greater than 15 mu m (y component) and a globular powder of which mean particle diameter is not smaller than 20 mu m and not greater than 70 mu m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume and exhibits an excellent fluidity even when loaded with a high percentage of filler. A semi-conductor package sealed with the resin composition exhibits a high package crack resistance. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017128734-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10759975-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3492437-A1 |
| priorityDate |
1994-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |