| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31522 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-63 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-14 |
| filingDate |
1968-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1975-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1975-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-1815148-C3 |
| titleOfInvention |
Method of bonding a surface containing at least 50 percent by weight copper to an organic material |
| priorityDate |
1967-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |