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filingDate 1968-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59f7d665c9f84481a1ceb8eb0f3a2097
publicationDate 1969-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-1806874-A1
titleOfInvention Process for curing epoxy resins
abstract Modification of solvent and hardener used in curing epoxy-resins. The hardener contains 45-55% by wt. diaminodiphenylmethane; (salicylic acid added as accelerator). The solvent contains 50-90% by wt. sulpholane + 50-10% by wt. dimethylsulphoxide or cyclohexanone. The mixture of solvent and hardener is stable enough to remain liquid and active during storage for 6 months at 20 deg.C. 100 ppw liquid epoxy resin (epoxy equivalent wt. = 185-215; viscosity = 12-18 poise at 25 deg.C) was treated in a mould at 0-5 deg.C with a curing mixt. of 25 ppw 4,4'-diamino-diphenylmethane + 16.7 ppw sulpholane + 4.15 ppw dimethylsulphoxide + 4.15 ppw salicylic acid. The moulding was hardened at 0-3 deg.C for 7 days and was found to have satisfactory properties.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2542751-A1
priorityDate 1967-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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