| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7ad58d3c0b071069a8ee0cb8c8ba2e8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
1967-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ef7aae4a8f7f3ac06e4364824790621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_919bc70e44de0b5198017caaacdf9127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f78644f5789da8d4bdf6e6502538ce70 |
| publicationDate |
1971-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-1621906-A1 |
| titleOfInvention |
Process for firmly adhering metallization of non-conductor materials, in particular for the production of printed circuits |
| priorityDate |
1967-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |