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publicationDate 2022-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-112020006067-T5
titleOfInvention ELECTROSTATIC CHUCK WITH REDUCED ELECTRICITY LEAKAGE FOR A HYBRID PROCESS FOR WAFER SEGMENTATION BY LASER SCRIPPING AND PLASMA ETCHING
abstract Electrostatic chucks with reduced current leakage and methods for dicing semiconductor wafers are described. In one example, an etching apparatus includes a chamber and a plasma source within or coupled to the chamber. Inside the chamber is an electrostatic chuck. The electrostatic chuck has a conductive base with a plurality of notches on a peripheral edge thereof. In addition, the electrostatic chuck has a plurality of lift pins corresponding to the plurality of notches, respectively.
priorityDate 2019-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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