http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112020002188-T5

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filingDate 2020-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_599000030f32ca72a3e07906559ba2f5
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publicationDate 2022-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-112020002188-T5
titleOfInvention Surface mount thin film fuse with compliant butts
abstract A surface mount thin film fuse component is disclosed, which may include a substrate having a top surface, a first end, and a second end longitudinally spaced from the first end. The thin film component may include a melt layer formed over the top surface of the substrate. The fusible layer may comprise a thin film fuse track. An external end portion may be located along the first end of the substrate and electrically connected to the thin film fuse trace. The external end portion may include a compliant layer comprising a conductive polymer composition.
priorityDate 2019-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.