Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f3e47c6c2d8d98eacba284a73c2302a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-143 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2085-0414 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2001-5888 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5256 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-0411 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-143 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H69-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H85-20 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H85-055 |
filingDate |
2020-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_599000030f32ca72a3e07906559ba2f5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95e1dff72385288bf83734b68ebc9da4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fb13d83d00884177a62ddce11e681bf |
publicationDate |
2022-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
DE-112020002188-T5 |
titleOfInvention |
Surface mount thin film fuse with compliant butts |
abstract |
A surface mount thin film fuse component is disclosed, which may include a substrate having a top surface, a first end, and a second end longitudinally spaced from the first end. The thin film component may include a melt layer formed over the top surface of the substrate. The fusible layer may comprise a thin film fuse track. An external end portion may be located along the first end of the substrate and electrically connected to the thin film fuse trace. The external end portion may include a compliant layer comprising a conductive polymer composition. |
priorityDate |
2019-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |