| abstract |
Procedure that includes: fabricating a plurality of chip layers each having at least one chip block, each chip block having a plurality of electrodes assigned a same function; stacking the plurality of chip layers sequentially with a rotation so as to form at least one stack of overlapping chip blocks, each stack including a plurality of groups of vertically arranged electrodes with shifts in the horizontal plane; for at least one of the plurality of groups, forming a through hole at least partially into the plurality of chip layers so as to expose electrode surfaces of vertically arranged electrodes in the at least one of the plurality of groups; and Filling the through hole with a conductive material. |