| abstract |
In one embodiment, a circuit board substrate comprises a polymer matrix; a reinforcement layer; and a plurality of coated boron nitride particles; wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxide, a polyphenylene ether, polystyrene, an ethylene-propylene-dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer or a crosslinked matrix, which is at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4 -Trivinylcyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate. |