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filingDate 2019-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d4927818aacd6a826337a600898778d
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publicationDate 2021-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-112019003626-T5
titleOfInvention IMAGING ELEMENT AND IMAGING DEVICE
abstract An imaging element according to an embodiment of the present disclosure includes: a semiconductor substrate; a first photoelectric converter; a through electrode, a first dielectric film; and a second dielectric film. The semiconductor substrate has one surface and another surface opposite to each other. The semiconductor substrate has a through hole extending between the one surface and the other surface. The first photoelectric converter is provided above the one surface of the semiconductor substrate. The through electrode is electrically coupled to the first photoelectric converter. The through electrode passes through the semiconductor substrate inside the through hole. The first dielectric film is provided on the one surface of the semiconductor substrate. The first dielectric film has a first film thickness. The second dielectric film is provided on a side surface of the through hole. The second dielectric film has a second film thickness. The second film thickness is less than the first film thickness.
priorityDate 2018-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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