http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112018007569-T5
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2368fce6d29577999731759a49c2d9a7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2018-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_192b3638b17d9ff19637dae19696533d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99c672b7aa5353e5df0f14f87f854bb7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cff4e8f89e3d8ecc87f70a24e72a9bcc |
| publicationDate | 2021-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-112018007569-T5 |
| titleOfInvention | Process for producing a protective layer for printed circuit boards |
| abstract | A method of manufacturing a circuit board protective layer comprises the steps of: coating a surface of a circuit board (1) with a protective ink and curing to form an ink layer (2), the ink layer (2) having a preset opening (201) and the thickness the printing ink layer (2) is greater than or equal to 10 µm; then removing the excess protective inks on the inner edge of the preset opening (201) using a laser engraving machine to form a protective layer with a finely carved opening (301). With the method of manufacturing a circuit board protective layer according to the present application, it is not necessary to manufacture the protective layer with the production processes such as exposure and development, etc. The process is simple and free of pollution. A high material utilization rate and a high resolution of the opening are achieved, and the process is suitable for the production of various volumes such as prototypes, small series and large batches. |
| priorityDate | 2018-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261 |
Total number of triples: 22.