| abstract |
Wireless modules having a semiconductor package mounted on an antenna housing are disclosed. In a single chip package and / or a system-in-package (SiP) implementation, the semiconductor package may house one or more electronic components. The antenna housing may be communicatively coupled to the semiconductor package using one or more coupling pads. The antenna housing may further comprise one or more radiating elements for transmitting and / or receiving radio signals. The antenna housing and the semiconductor package may have different numbers of interconnect layers and / or different materials of construction. |