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filingDate 2015-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aaa4ee2c6117aceb641f98a623d536cb
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publicationDate 2017-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-112015003959-T5
titleOfInvention A silicon carbide semiconductor device and a method of manufacturing the same
abstract A silicon carbide epitaxial layer (120) comprises: a first impurity region (61) having a first conductivity type; a second impurity region (62) in contact with the first impurity region (61) and having a second conductivity type different from the first conductivity type; and a third impurity region (63) separated from the first impurity region (61) by the second impurity region (62) and having the first conductivity type. A gate insulating film (57) is in contact with the first impurity region (61), the second impurity region (62), and the third impurity region (63). A groove portion (20) is formed in a surface (161) of the first impurity region (61), the surface (161) being in contact with the gate insulating film (57), the groove portion (20) extending in a direction along the Surface (161), wherein a width of the groove portion (20) in the one direction is twice as large or larger than a width of the groove portion (20) in a direction perpendicular to the one direction, wherein a maximum depth of the groove portion (20) of the surface (161) is not more than 10 nm.
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