| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
2012-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65dd13b7bd97e22371fecd54c47af67e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c087e10e2acfc4d253ed1f4d0f62457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f51c409afcc7fc80b5543410c256a2c |
| publicationDate |
2014-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-112012005486-T5 |
| titleOfInvention |
Thermally conductive resin composition |
| abstract |
The present invention provides a thermally conductive resin composition which can realize a high thermal conductivity by incorporating a specific thermally conductive inorganic filler without increasing the content of a thermally conductive filler, and which also has satisfactory moldability. There is disclosed a thermoconductive resin composition comprising a thermally conductive filler and a binder resin, wherein the thermally conductive resin composition as the thermally conductive filler contains an irregularly shaped filler having protrusion / recess structures on the surface thereof. |
| priorityDate |
2011-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |