http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112010000791-T5
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d6130c4f3325f6b7d043ce632cb6fc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6fc8bbba7dbfdc1fe42f350fc84e17a3 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-615 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-62 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-62 |
filingDate | 2010-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3273f90b17948dc1ff330fa7646b077 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95b6ab844b3747099e73681949419706 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8a7bda853cbad8292ec11dce3f832a0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9d4affa7139111a67c162740fcdf59a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_182bbb3e52659ac3ff28c1126be97bd1 |
publicationDate | 2012-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | DE-112010000791-T5 |
titleOfInvention | MIXED-MICROCRYSTALLINE-AMORPHIC GOLD ALLOYING OF ELECTROCHEMICALLY DISPOSED FILM AND BATHING SOLUTION, AND METHOD FOR PRODUCING AN ELECTROCHEMICALLY DISPOSED FILM THEREFOR |
abstract | Disclosed is an electrodeposited microcrystalline-bis-amorphous gold alloy film having excellent electrical properties and mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by having a microcrystalline phase and an amorphous phase in a mixed state, in a specific ratio. The average grain size of the microcrystals is 30 nm or less, the volume fraction of the microcrystals is 10 to 90%, the Knoop hardness is Hk 180 or more, the specific resistance is 200 μΩ · cm or less. Hardness and abrasion resistance of the film, both inherent in gold at virtually insignificant height, can be improved while maintaining good resistivity and chemical stability. The film is therefore useful as a material for connecting an electrical or electronic component such as a connector or a relay. |
priorityDate | 2009-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.