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filingDate 2004-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-112004001684-T5
titleOfInvention Seed repair deep vias (via) using electroless plating chemistry
abstract A method of forming a seed layer comprising: Forming a discontinuous metal layer within a recess in a substrate; Activating the non-continuous metal layer and at least one non-deposited area within the recess; and Electroless deposition of a seed layer on the discontinuous metal layer and on the at least one non-deposited region within the recess.
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