patent/DE-10392228-T5

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10392228-T5

Outgoing Links

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filingDate	2003-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec7356bf1daebcbf98d7db5c3639da94
publicationDate	2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	DE-10392228-T5
titleOfInvention	Semiconductor chip package with semiconductor chip with side electrical connection
abstract	Method with the steps (a) to form a semiconductor wafer having a plurality of semiconductor chips formed by tear lines; (b) form a plurality of cavities in the semiconductor wafer in the vicinity of the tear lines, and (c) Dicing the wafer along the tear lines to separate the dies, each separate die including a vertical transistor and at least one recess on an edge of the die.
priorityDate	2002-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667

Total number of triples: 65.