| abstract |
A housing arrangement for an electronic device for mounting on vehicles according to the present invention has better heat dissipation, better water resistance, better heat resistance and better vibration resistance. An electronic substrate is temporarily fixed on an annular peripheral wall part of a cover made of a refractory resin, and connector contact pins are soldered to the electronic substrate. The electronic substrate is fastened and held between screws by a heat transfer base and the annular peripheral wall part, and heat generated from a heating part from the electronic substrate is transferred to and released from the base. The annular peripheral wall part has an annular groove in which a sealant is filled, and the base has an annular projection which is snapped into the annular groove. |