| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_54da2c55acc520080b9f194c7a839f23 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0012 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2003-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d070627db8b47611201b2461172c145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7592064a458c87fb396283030b81ada3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c8dbdd70f3ac4752535965f1efea2c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4a417ce304de50b248a5b02e1a66fc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16489220d80be794162fcd7a5d52a069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82747eac3a2ed3facd10c8842a74291d |
| publicationDate |
2005-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10336091-A1 |
| titleOfInvention |
Component with a low-corrosion epoxy resin |
| abstract |
ThenThe invention relates to a device with a crystalline or ceramicncomponent bodynor with a component body,ncomprising at least one crystalline or ceramic layer,nand with a metallization applied to the component body,ncomprising the component structures and pads. Such a devicenmay be a semiconductor electrical device or a MEMS devicenbe. It may comprise a piezoelectric ceramic and as microacousticnComponent designed in particular as SAW or FBAR componentnbe. In contact with the metallization is in these devicesnan epoxy resin is applied to the component body having anTotal content of halogen and especially chlorine, organically boundnand / or ionic present, of less than 100 ppm. |
| priorityDate |
2003-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |