http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10328362-A1

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filingDate 2003-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0a0d291525bf72497d235ac36d6f2d9
publicationDate 2005-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-10328362-A1
titleOfInvention Method for producing a printed circuit board with an integrated marking step
abstract The invention relates to a method for producing a printed circuit board with the steps: a) exposing a photo-sensitive layer of a printed circuit board substrate for defining printed conductors, b) etching the PCB substrate, c) removing the photosensitive layer from the circuit board substrate and e) coating the circuit board substrate with a solder resist layer leaving solder joints free, wherein a marking step is integrated into the production method, in which a material removal with a predetermined pattern takes place by means of a surface treatment device.
priorityDate 2003-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 25.