| abstract |
A power supply contact point for a power supply wire on a positive voltage side and a power supply contact point for a power supply wire on a negative voltage side are provided next to one another on the circuit areas of integrated chips (101, 102). A first group of two power supply wires (111, 112) and a second group of two power supply wires (121, 122), each with two power supply contact points of the integrated circuit chips (101, 102), are flip-chip contacted on a printed circuit board (103) printed on one side. The first and second group of power supply wires (111, 112, 121, 122) are formed essentially parallel to one another by maintaining essentially constant wire widths and a substantially constant wire spacing. Close to the outer periphery of the circuit board (103), the first and second group of power supply wires (111, 112, 121, 122) are slightly bent to follow the periphery. |