http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10319509-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0504 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02S30-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-043 |
| filingDate | 2003-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5082fd8c60db9bfc050d39452c12556d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4de7a3f7c79d57608de99bd08d97e70 |
| publicationDate | 2004-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-10319509-A1 |
| titleOfInvention | Circuit module, method for manufacturing a circuit module and carrier for receiving semiconductor elements |
| abstract | A circuit module comprises a carrier having a first and a second receiving area and a conductor track structure. The circuit module further includes a first crystalline semiconductor element and a second crystalline semiconductor element, wherein the first and second semiconductor elements are arranged to be electrically coupled by the wiring pattern. The first and second semiconductor elements are secured to the carrier by means of a fastener, wherein the carrier or cover is formed so that a tensile or compressive stress generated by a bending of the circuit module is stronger through a portion of the circuit module between the semiconductor elements than through the first or second semiconductor device second recording area is recorded. As a result, particularly powerful solar cell modules are obtained for a variety of applications on curved or flexible surfaces. |
| priorityDate | 2003-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.