| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a62c92e56568bd104089aac22ca487b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate |
2003-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b3ca238ee4179e4aa811f70201fe547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53b6c38a570a26e12eba7e606d9d2ef1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_635662850f07e71769f192d6e1359081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e2fb6f32d4e7ec9762d49b2447ddb94 |
| publicationDate |
2004-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10319135-A1 |
| titleOfInvention |
Process for electroplating copper over a patterned dielectric layer to improve process uniformity in a subsequent CMP process |
| abstract |
Inna method of plating metal onto a dielectricnLayer with contact bushingsnwith small diameter and trenchnwith bignDiameter becomes a surface roughnessnat least on non-structured areas of the dielectric layerngenerated to the uniformitynimprove material removal in a subsequent CMP process. |
| priorityDate |
2003-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |