| abstract |
A curable adhesive composition comprising in combination the following components: a curable silicone composition, wherein the curable silicone composition contains: (I) Inorganic insulator particles having an average particle size of 10 μm to 1000 μm and a major axis to minor axis ratio of about 1.0 to 1.5, wherein the inorganic insulator particles are present in the composition in an amount sufficient to provide a planar adhesive bond thickness between the adhesively bonded substrates, and (II) at least one filler having a low coefficient of thermal expansion and an average particle size of less than 10 microns in an amount greater than 50 weight percent, based on the weight of the curable silicone composition, and in an amount sufficient to form an adhesive with a to obtain linear thermal expansion coefficients before and after the glass transition temperature of less than 240 μm / m / ° C between -55 ° C and + 200 ° C when measured at a heating rate of 5 ° C / min, the fillers having a low thermal expansion coefficient with sizes from... |