abstract |
Curable adhesive composition,nwhich in combination comprises the following components: a curablenpolymeric base material and in the polymeric base materialnorganic insulator particles with an average particle size of 1 μm to 1,000 μm and onenrelationshipnMajor axis to minor axis from about 1.0 to 1.5, with the organicnInsulator particles in the composition in a sufficient amountnare present to have a planate adhesive bond thickness betweennthe substrates that are bonded by the adhesive. |