| abstract |
A curable adhesive composition comprising in combination the following components: A. a curable polymeric base material comprising a curable silicone composition; B. wherein are contained in the polymeric base material: (i) inorganic insulator particles of mixed different sizes and having an average size of less than 10 microns, the inorganic insulator particles being present in an amount sufficient to provide an adhesive having a linear thermal expansion coefficient before and after any glass transition temperature of less than 240 microns / m / ° C to obtain between -55 ° C and + 200 ° C, and (ii) organic insulator particles having an average particle size of 10 μm to 1000 μm and a major axis to minor axis ratio of about 1.0 to 1.5, wherein the organic insulator particles in the composition are in an amount of 0.16 to 0.69 Wt .-% of the curable adhesive composition are present. |