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filingDate 2002-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f167fbba9275700713cb99c69b09dc4e
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publicationDate 2004-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-10260851-A1
titleOfInvention Method of manufacturing a cooling device for power devices
abstract The invention relates to a method for producing a cooling device for a power component with the following method steps: A) soldering the power component to a solderable material containing surface of a heat sink of a metal infiltrated with a ceramic and B) adhering the heat sink to a base plate by means of a thermally conductive adhesive; and to a cooling device for a power component (1), in particular for use in an electronic control unit, comprising a metal infiltrated ceramic body as a heat sink (2) whose surface is adhesively bondable on one side and solderable on another side (3) to be cooled power component (1) is soldered to the solderable surface (3) of the heat sink (2) and the heat sink (2) with the adhesive surface by means of a thermally conductive adhesive (4) on a base plate (5) is attached.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102010000035-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102014107742-B4
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Total number of triples: 52.