http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10253163-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_54da2c55acc520080b9f194c7a839f23 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-059 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
| filingDate | 2002-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4ce5616e9e4f9ada13ba8c49f26edea |
| publicationDate | 2015-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-10253163-B4 |
| titleOfInvention | Hermetic encapsulation device and wafer scale manufacturing method |
| abstract | Component with hermetic encapsulation - With a sandwich-bonded structure whose outer edges are aligned, comprising A chip (Ch), on the surface of which component structures (BS) and connection metallizations (AM) connected thereto are realized, A frame structure (RS) enclosing the component structures (BS) and forming a closed cavity within the sandwich structure, and A diffusion-proof cover (AD), wherein the frame structure (RS) acts as a spacer between the chip (Ch) and the cover (AD) and wherein the component structures (BS) in the closed cavity between the cover (AD) and the Chip (Ch) is formed, are arranged With a backside metallization (RM) extending over the back of the chip (Ch) beyond the abutting edges of the interfaces of the sandwiched structure, - with underside contacts (UK) on the side facing away from the chip (Ch) bottom of the cover (AD), With printed contacts (DK) through the cover (AD), which electrically connect the component structures (BS) on the chip (Ch) to the underside contacts, - Wherein the inner surfaces of the Durckkontaktierungen metallized with a Unterseitenmetallsierung (UM) and are thus sealed diffusion-tight. |
| priorityDate | 2002-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.