http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10253163-A1

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filingDate 2002-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-10253163-A1
titleOfInvention Device with hermetic encapsulation and wafer-scale manufacturing process
abstract A component with a sandwich-like structure is described in which the chip carrying the component structures is glued to a frame structure and a diffusion-tight cover in such a way that the component structures are arranged inside the structure and preferably in a cavity. The layer transitions of the structure are protected on the side edges with a metallization. Vias through the cover connect contacts on the underside of the cover to the connection metallizations of the component structures on the chip. The plated-through holes are sealed with an underside metallization.
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