| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 |
| filingDate |
2002-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7779f602bb85b94363a73fa6408399f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eab1b916ebfd6eff90df725a58b2f389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_591470e94cb7253fc5810a665804166e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83f29b56bcc4b763f6dd2dbaeb3a796d |
| publicationDate |
2003-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-10239091-A1 |
| titleOfInvention |
Resin formulation and its use |
| abstract |
Thermal curing resin formulations are described which consist of a cationically curable resin and a Wheland complex with a non-nucleophilic anion as initiator. Typical formulations are characterized by rapid curing at moderate temperatures and high storage stability at room temperature. The formulations are particularly suitable as a basis for adhesives, casting compounds, lacquers or printing inks. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010144028-A |
| priorityDate |
2001-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |