| abstract |
The invention relates to an encapsulated component which contains a carrier substrate and at least one chip arranged on the upper side of the carrier substrate and electrically connected thereto by means of electrically conductive connections. The encapsulation of the chip is achieved with a seal or dielectric layer. As a result of different coefficients of expansion of the seal or dielectric layer and the electrically conductive compounds occur in temperature changes tension in the electrically conductive connections, which can lead to cracks, breaks and even to interrupt the electrically conductive connections. For mechanical relief of the electrically conductive connections of stresses during temperature changes (in particular under extreme thermal loads), it is proposed to provide the carrier substrate with a peripheral support member surrounding the chip, which serves to support the seal or dielectric layer, and / or the material and the Arrangement of the encapsulation to choose accordingly. |