| abstract |
A photoreactive resin composition with high sensitivity, which causes little gelation, and methods for producing a printed circuit board and a ceramic multilayer substrate with a high-resolution conductor pattern and contact holes by a photolithography process using the photoreactive resin composition are described. The photoreactive resin composition contains an inorganic powder containing a polyvalent metal powder and / or a polyvalent metal oxide powder, an alkali-soluble first polymer with an ethylenically unsaturated double bond, a monomer with an ethylenically unsaturated double bond, a photoreaction initiator, an organic solvent and a second polymer with one Pyrrolidone ring in a side chain. |