http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10225377-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N10-01 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M1-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L35-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L35-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J5-16 |
| filingDate | 2002-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10eb439d47425be7fd15647ccebda8d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfe7e4fe7bd17d3fcd52a2201e85acbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86173697c2c17bbad524ab181c237075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54c813258401d5854b89fa9dedf1cf38 |
| publicationDate | 2014-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-10225377-B4 |
| titleOfInvention | Method of manufacturing a thermopile infrared radiation sensor |
| abstract | Method of manufacturing a thermopile infrared radiation sensor comprising the steps of: Providing a substrate (1) having first and second surfaces (1a, 1b); Forming a first material layer (6) having a plurality of parts on the first surface (1a) of the substrate (1) with a first conductive material; Forming a layer of a second material (8) having a plurality of parts with a second conductive material different from the first conductive material to form first and second connecting portions (11, 12) with a plurality of portions of the layer of the first material ; Forming either an opening cut (2) or a recessed portion (50) by etching the substrate from the second surface where the first connection portion is formed; Performing screen printing of an infrared ray absorbing layer (10) on the substrate to cover the first joint portion after forming either the opening portion or the recessed portion, wherein the screen printing of the infrared ray absorbing layer includes the screen printing of the infrared ray absorbing layer such that a pressure applied to the substrate is at most 0.25 MPa. |
| priorityDate | 2001-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.