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filingDate 2002-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-10212022-A1
titleOfInvention Process for applying an adhesion promoter layer
abstract A method for applying an adhesion promoter layer to a spatially limited metal layer (14), in particular an electronic chip (10), is proposed, the metal layer (14) being activated on the surface. The activation is carried out in an electrochemical cell (30) (FIG. 2).
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