Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5b162151c1fc1d2e9d7d28f3bf1fe3e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e79c7785ed9b1eff8a47b93114f35c27 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 |
filingDate |
2021-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_830a6c99f20d822e318a6913e2501311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f68cd3aba84821ec709495cfc2f41f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d597468d830a6cfaa15ef96fb42e31c6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a19bea7d95628ebd9d6dfb881154019a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f52d86fd4badbf5dc40aea6005abf67d |
publicationDate |
2022-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
DE-102021214542-A1 |
titleOfInvention |
Curable silicone composition, encapsulant and optical semiconductor device |
abstract |
[Problem to be Solved] It is desired to provide a curable silicone composition which exhibits excellent thixotropy and has reduced dimensional change and shrinkage factor upon curing. [Means for Solving the Problem] The problem is solved by a curable silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by the average unit formula (I): (R 1 3 SiO 1/2 ) f (R 2 2 SiO 2/2 ) g (R 1 SiO 3/2 ) h (SiO 4/2 ) i (XO 1,2 ) j {in the formula ( I) R 1 are in each case independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, with at least two R 1 being alkenyl groups; R 2 are in each case independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, at least one R 2 being an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0 ≤ f <1;0<g<1; 0 ≤ h <0.9; 0 ≤ i <0.5; and 0<j<0.5; f + g + h + i + j = 1.0; h + i >0; and j/(f + g + h + i + j) >0.05}; and (D) a curing catalyst. |
priorityDate |
2020-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |