http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102021201151-A1

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filingDate 2021-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af6df2054132cb695824de2707a68102
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publicationDate 2022-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102021201151-A1
titleOfInvention MEMS package and method for encapsulating a MEMS structure
abstract A method for encapsulating a MEMS structure in a stacked structure includes providing a functional wafer structure that at least partially includes the MEMS structure. The method includes arranging the functional wafer structure and a glass wafer in the stack structure and along a stacking direction to one another and is carried out such that a cavity in which at least part of the MEMS structure is arranged is closed on one side along the stacking direction with the glass wafer and such that a spacer structure is placed between the part of the MEMS structure and the glass wafer in the stacking structure to provide a space between the part of the MEMS structure and the glass wafer along the stacking direction such that the spacer structure encloses part of the cavity .
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Total number of triples: 23.