Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2cdf7fc287e0b226df06edfbaaf05585 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2477-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-28 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D177-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
filingDate |
2021-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe2f207759cbf4984e870ab0c739d2b5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9072c72a8ec095b543872a1f86aec610 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1ca1a72bbb4d9873607943bcf3339c7 |
publicationDate |
2021-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
DE-102021100760-A1 |
titleOfInvention |
Curable resin composition, its use and method for its production |
abstract |
object The present invention provides a curable resin composition capable of imparting high durability and adhesion to a substrate such as a metal. [Solution] A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B) and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170 ° C. or higher and a polyamide-based resin (A2) having a melting point of 150 ° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in terms of the former / the latter, from 65/35 to 35/65. |
priorityDate |
2020-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |