http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102020209965-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y70-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y80-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y80-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C64-129 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y70-00 |
| filingDate | 2020-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d40d4edbaa4ef3105d86add34b524e68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72d378fe0dbbd684a01d5cb9edda7fe4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ff18e8a4abc56c9745f01e65bc6dbe6 |
| publicationDate | 2021-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102020209965-A1 |
| titleOfInvention | Process for manufacturing electronic components |
| abstract | The invention relates to a method for manufacturing complete electronic components (64) with electronic and / or non-electronic components (74), which are built in a housing ( 60), whereby the following procedural steps are carried out: a) Printing an outer contour (48) of a 2D structure (50), b) Networking 52 of the outer contour (48) of the 2D structure (50), c) by means of a UV light source (34), d) filling 54 of the outer contour (48) in such a way that individual layers (80) are produced in the desired geometry with recesses for at least one cavity (70, 72, 100, 114), e) renewed crosslinking (52) of the closed 2D structure (56) by means of the UV light source (34), f) generation of a stack structure (58) by repeating steps a) to e), g) Filling adhesive into the at least one cavity (70, 72, 100, 114) in a defined amount, h 1 ) placing at least one electronic or non-electronic component (74) in the at least one cavity (70, 72) and creating a closed individual layer (80) with an embedded component (74) or h 2 ) Production of 2D conductor track structures (88) or 3D conductor track structures (106) in cavities (100, 114), in particular channels or on open areas (92), by dispensing a conductive adhesive (102) into the cavities (100, 100) designed as channels. 114) or on the open spaces (92), i) renewed crosslinking (52) of the closed 2D structure (56), j) repeating method steps a) to e) until a complete stack structure (58) has been built in the Z direction (30) and k) curing of the resulting stack structure (58) of the complete electronic component (64) made of 2D structures (50) in the Z direction (30). |
| priorityDate | 2019-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.