| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_41ac7ff6ab574ca3737b892da2ebfe6f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05638
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32503
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-33181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83447 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2019-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1849731af8c40350328e744adc93eb3f |
| publicationDate |
2020-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102019135860-A1 |
| titleOfInvention |
Semiconductor device and manufacturing method therefor |
| abstract |
A method of manufacturing a semiconductor device that includes a plurality of elements including a semiconductor element is provided. The method may include arranging a surface of a first element that is one of the plurality of elements and a surface of a second element that is another of the plurality of elements so that they are interposed with a tin-based (Sn- based) solder are opposed to each other, and include joining the first element and the second element by melting and solidifying the Sn-based solder. At least one surface of the first element can be formed from a nickel-based (Ni-based) metal and at least one surface of the second element can be formed from copper (Cu). |
| priorityDate |
2019-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |