| abstract |
The invention relates to the field of ceramics and relates to a method, for example for applications in displays of electronic devices with increased mechanical stress. The object of the present invention is to provide a method with which thin ceramic parts with thicknesses of substantially <1 mm are produced with high transparency. The object is achieved by a process for the production of thin transparent ceramic parts, in which ceramic powders are mixed together with a solvent and a monomer and a photoinitiator, and at least 0.0005% by mass of a photoinitiator are added, subsequently the mixture in a mold is introduced, then the mixture is irradiated with light for at least 1 min, which has a wavelength for activating the photoinitiator, the molded body is subsequently removed from the mold and dried, and then the debinding and sintering of the molded body is carried out. |