| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95b250eb14bbc2f072933344bb091383 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-73921
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-7392
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-1122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-7465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-72321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-5346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0887
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-756
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-24 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C67-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-502707
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B1-00 |
| filingDate |
2019-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f9c47f77d676017cfb302265b19f0a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e040d079475f693f9c566b67900bbd8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f87d6bb4195ac6a5973f98947b4af671
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_048574d0e272c18f8c9edb5e39a01368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe5dfc330258f4eeee30c3568010b10c |
| publicationDate |
2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102019107090-A1 |
| titleOfInvention |
Microstructure with thermoplastic embossing lacquer layer and manufacturing process |
| abstract |
The present invention provides a microstructure comprising a carrier (1), an embossed thermoplastic lacquer layer (2) and a cover layer (3) in this order, the connection of the lacquer layer (2) to the cover layer (3) by a thermal Bonding existing process can be produced and the lacquer layer (2) contains a polymer which can be produced by radical polymerization of monomers, 99 to 100% by weight of the monomers being non-crosslinkable and 0 to 1% by weight of the monomers being crosslinkable. The present invention also provides a method for making the microstructure of the invention. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102021001589-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022117716-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4008434-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023072369-A1 |
| priorityDate |
2019-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |