http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102018122568-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9884b2360f2413d7edea0d5af39f775a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0016 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21S43-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21S41-141 |
| filingDate | 2018-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fd64d06e9ec9c6eda5b90ee6fca6116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cf8000212902d59307735468076230b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cb0549f8b152851a90b56fc79a0459b |
| publicationDate | 2020-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-102018122568-A1 |
| titleOfInvention | OPTOELECTRONIC SEMICONDUCTOR COMPONENT WITH FIRST AND SECOND CONTACT ELEMENTS AND METHOD FOR PRODUCING THE OPTOELECTRONIC SEMICONDUCTOR COMPONENT |
| abstract | An optoelectronic semiconductor component (10) comprises an optoelectronic semiconductor chip (15). The optoelectronic semiconductor chip has a first semiconductor layer (100) of a first conductivity type, a second semiconductor layer (110) of a second conductivity type, a first contact element (115) which is electrically conductively connected to the first semiconductor layer (100), and a second contact element (117), which is electrically conductively connected to the second semiconductor layer (110). The first semiconductor layer (100) and the second semiconductor layer (110) are arranged one above the other to form a layer stack. The first semiconductor layer (100) is structured so that part of the second semiconductor layer (110) is exposed. The first contact element (115) is arranged above the first semiconductor layer (100) and the second contact element (117) is arranged above the first semiconductor layer (100). Parts of the first contact element (115) are arranged at the same vertical height as parts of the second contact element (117) within a region in which the second contact element (117) overlaps with the first semiconductor layer (100). |
| priorityDate | 2018-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.