| abstract |
Disclosed is a method for producing an electrically conductive substrate comprising a base material and an electrically conductive pattern layer provided on the side of a main surface of the base material. The subject method comprises a step of forming, by means of an embossing method, a trench having a bottom surface with the base layer exposed and side surfaces comprising the surface of the trenching layer and a step in which the bottom surface of the trench formation layer Grabens exposed base layer grows a metal coating, whereby an electrically conductive pattern layer is formed on. |