| abstract |
The invention relates to a method for producing a circuit carrier arrangement (30) having a first substrate (32), wherein a first, made of aluminum, electrically conductive surface on a first surface (34) of the first substrate (32) by conversion of aluminum nitride into aluminum (36) is formed, wherein a second electrically conductive surface (42) of a second substrate (38) with the first electrically conductive surface (36) of the first substrate (32) is materially connected. Furthermore, the invention relates to a circuit carrier assembly (30) produced by the method. |