| abstract |
A terminal processing apparatus for processing a semiconductor device (51) comprising a sealing resin body (57) in which a semiconductor element (55) is molded with a molding resin, the sealing resin body (57) having a surface (57a) from which a plurality of external terminals (61) protrudes in a first direction, wherein the plurality of external terminals (61) are connected to one another via a holding web (69) and electrically connects the semiconductor element (55) and an outside with one another, the terminal processing device comprising: A mold plate (5), in a state in which the semiconductor device (51) is arranged so that the surface (57a) of the sealing resin body (57) faces upward in such a way that the first direction in which the plurality of external terminals (61) protrudes from the surface (57a), corresponds to an upward direction, wherein the mold plate (5) is moved in the first direction to the surface (57a) of the sealing resin body (57), so that the mold plate (5) is arranged is to face the plurality of external terminals (61), the die plate (5) having a receiving hole (5a) extending in a second direction crossing the first direction; and A punch (41) in a state in which the mold plate (5) is arranged to face the plurality of external terminals (61), the punch (41) facing in the second direction toward the receiving hole (5a) of the mold plate (5) is moved from an opposite side of the plurality of external terminals (61) from the mold plate (5) so that the punch (41) cuts off the holding web (69) which connects the plurality of external terminals (61) and cuts a resin ridge (71) protruding from the sealing resin body (57). |