| abstract |
The invention relates to a terminal processing apparatus (1) in which a semiconductor device (51) is arranged so that a surface (57a) of a sealing resin body (57) faces upward, so that external terminals (61) project upwardly. A mold plate (5) is interposed between the one group of external terminals (61) and the other group of external terminals (61). A scraper (7) is arranged so as to oppose the mold plate (5). In this state, a punch (41) is moved in a direction toward the die plate (5) crossing a direction from which the external terminals (61) protrude, thereby cutting off a holding web (69) and the like. The die plate (5) has a receiving hole (5a) into which the punch (41) is inserted. |