| abstract |
Manufacturing method (100) for a double membrane MEMS component (300), with the following steps: Providing (120) a layer arrangement (200) on a carrier substrate (210), the layer arrangement (200) having a first and second spaced apart membrane structure (220, 230) and a counter electrode structure (240) arranged between them, wherein a sacrificial material (250) is arranged in an intermediate region (260) between the counterelectrode structure (240) and the first and second membrane structures (220, 230) spaced apart therefrom, and wherein the first membrane structure (220) has an opening structure (270) to the intermediate region (260) with the Has sacrificial material (250), and partially removing (140) the sacrificial material (250) from the intermediate region (260) to obtain a mechanical connection structure (280) comprising the sacrificial material (250) between the first and second membrane structures (220, 230), which is between the first and second Membrane structure (220, 230) is mechanically coupled and mechanically decoupled from the counter-electrode structure (240); wherein the opening structure (270; 270, 272) in the first membrane structure (220) or in the first and second membrane structure (220, 230) is formed in such a way that based on the etching rate and etching selectivity of the etchant for the sacrificial material (250) in the Etching process to form the mechanical connection structure (280; 280-n) comprising the sacrificial material (250). |